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Dump Vivo Y31d (PD2533F) Dump File

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[Technical Overview & Write Guide] Vivo Y31d (PD2533F) Qualcomm Snapdragon 4 Gen 2 UFS Dump & Dead Boot Repair​

Device & Hardware Architecture:

  • Device Model: Vivo Y31d (Internal Project ID: PD2533F / PD2533)
  • Platform / SoC: Qualcomm Snapdragon 4 Gen 2 (SM4450 / 4nm Samsung 4LPP)
  • Baseband / Modem: Integrated Snapdragon X61 5G Modem
  • Storage Interface: UFS 2.2 Dual-Lane
  • Storage Capacities: 128GB / 256GB
  • Storage IC Form Factor: BGA 153 UFS (Micron / SK Hynix / Samsung)
  • Stock OS Baseline: Android 15 / Android 16 (OriginOS / Funtouch OS)
  • File Target: Qualcomm Multi-LUN Raw Sector Dump Set (LUN0_userarea_minimal.bin, LUN1_xbl_a.bin, LUN2_xbl_b.bin, LUN3_rpmb.bin, rawprogram0.xml, patch0.xml)
  • Application: Dead boot recovery, unbricking Qualcomm Emergency Download (EDL 9008) mode handshake loops, repairing broken/wiped partition tables (GPT corruption), and direct UFS 2.2 IC replacement via hardware programmers (EasyJTAG Plus UFS, UFI UFS Prog, MiTester, Medusa Pro II).

Critical Hardware Warnings & Security Protocols​

  • Vivo Qualcomm SLA / Firehose Authorization:
    • Flashing the PD2533F via USB EDL (9008) requires authorized Vivo server-side credentials. Generic QFIL loaders or unauthorized multi-brand tools will encounter Sahara / Firehose Auth Signature Validation Failed.
    • Direct chip-level flashing (via desoldered BGA socket or high-speed ISP) writes directly to physical storage blocks, completely bypassing the CPU EDL cryptographic authentication gate.
  • RPMB Hardware Provisioning:
    • The Snapdragon 4 Gen 2 (SM4450) permanently programs and pairs its Replay Protected Memory Block (RPMB) key to the UFS IC upon first initialization.
    • For an IC replacement, the replacement UFS chip must have an unprovisioned RPMB (counter 0x0). If using a donor UFS chip, you must transplant the matched pair: SM4450 CPU + UFS IC together from the donor board.
  • Preserve Baseband & Radio Calibration (EFS / NVRAM):
    • Modem calibration tables, RF filters, and dual-IMEI parameters reside in dedicated Qualcomm non-volatile sectors on LUN 0.
    • Always perform a raw backup of: modemst1, modemst2, fsg, fsc, persist, vivo_reserve
    • Overwriting or formatting these sectors without a device-specific backup leads to an unknown baseband, null IMEI, or permanent loss of cellular network reception.

Vivo Y31d (PD2533F) UFS Multi-LUN Layout​

Plaintext

Code:
Vivo_Y31d_PD2533F_SM4450_Dump/
├── rawprogram0.xml                  (Qualcomm LUN0 partition boundary map)
├── patch0.xml                       (Qualcomm disk size patch descriptor)
├── LUN0_userarea_minimal.bin        (Minimal 2GB–4GB GPT Header or Full Userarea)
│   ├── boot_a / boot_b              (Linux GKI kernel binary + ramdisk)
│   ├── init_boot_a / b              (Early boot init ramdisk)
│   ├── vendor_boot_a / b            (Hardware device tree & peripheral modules)
│   ├── dtbo_a / dtbo_b              (Device tree blob overlay)
│   ├── vbmeta_a / vbmeta_b          (AVB 2.0 cryptographic hashes)
│   ├── abl_a / abl_b                (Android Bootloader / Fastboot interface)
│   ├── modem_a / modem_b            (Snapdragon 5G modem baseband firmware)
│   ├── modemst1 / modemst2          (EFS baseband calibration data)
│   ├── fsg / fsc                    (Golden calibration records)
│   ├── persist                      (Sensors & camera hardware calibrations)
│   └── super                        (Dynamic logical partitions: system, vendor, product, odm, vivo)
├── LUN1_xbl_a.bin                   (4096 KB / 4 MB - eXtensible Bootloader Slot A)
├── LUN2_xbl_b.bin                   (4096 KB / 4 MB - eXtensible Bootloader Slot B)
├── LUN3_rpmb.bin                    (Encrypted RPMB block - reference only)
└── raw_gpt_lun0.bin                 (Primary GUID Partition Table descriptor)

Step-by-Step Direct UFS / Box Flashing Instructions (EasyJTAG Plus / UFI UFS)​

Step 1: Hardware Connection (BGA Socket vs. High-Speed ISP)​

  1. Via Direct BGA Socket (Recommended):
    • Desolder the BGA 153 UFS IC using a temperature-controlled rework station (240°C–250°C).
    • Clean remaining underfill and lead-free alloy with solder flux and copper wick.
    • Reball the IC using leaded solder balls (183°C) or precision stencil paste.
    • Seat the chip securely into the dedicated BGA 153 UFS socket adapter on your programmer.
  2. Via High-Speed ISP:
    • Solder micro-jumpers for TX_P/N, RX_P/N, REF_CLK, RST_N, and GND.
    • Keep wire lengths under 3 cm to prevent signal degradation on high-frequency differential traces.
    • Supply 3.3V to VCC and 1.2V to VCCQ (or power the motherboard via USB-C to ensure PMIC rail stabilization).

Step 2: Programmer Initialization & LUN Verification​

  1. Launch EasyJTAG Plus UFS Tool or UFI UFS ToolBox.
  2. Select interface mode: UFS Direct at PWM Gear 1 (or HS-G1 for verified setups).
  3. Click Check UFS / Scan:

    Plaintext

  4. Code:
    Platform: Qualcomm Snapdragon 4 Gen 2 (SM4450 / PD2533F)
    UFS Vendor: Samsung / Micron / SK Hynix
    UFS Spec: 2.2
    Boot Configuration: Boot from LUN 1 (Boot A / XBL) Enabled
    LUN 0: Capacity ~119.24 GB / ~238.48 GB
    LUN 1: Capacity 4096 KB (XBL Slot A)
    LUN 2: Capacity 4096 KB (XBL Slot B)
    LUN 3: Capacity 4096 KB (RPMB)

Step 3: Writing Dump Blocks to Storage​

  1. Write Primary Boot Stages (XBL):
    • Flash LUN1_xbl_a.bin into LUN 1.
    • Flash LUN2_xbl_b.bin into LUN 2.
  2. Write Partition Map & Core Boot Blocks (LUN 0):
    • Write raw_gpt_lun0.bin (or deploy via rawprogram0.xml) to rebuild the GUID Partition Table.
    • Flash core boot partitions: xbl_config_a, abl_a, boot_a, init_boot_a, vendor_boot_a, dtbo_a, and vbmeta_a.
    • If writing a minimal dump, flash the first 2GB–4GB of LUN0_userarea_minimal.bin to populate the secondary bootloader (ABL) and Fastboot environment.
  3. If previously backed up from the original board, restore modemst1, modemst2, fsg, fsc, and persist.
  4. Verify checksum logs to confirm zero ECC transmission errors or write timeouts.

Step 4: Reassembly & Fastboot Firmware Recovery​

  1. Solder the reballed UFS chip back onto the phone's PCB (or disconnect all ISP jumpers).
  2. Reassemble the board into the frame, connect the battery, and hold Volume Down + Power.
  3. The phone will boot straight into Vivo Fastboot Mode.
  4. Connect the phone to your PC via a USB-C data cable.
  5. Deploy the official Vivo Y31d (PD2533F) Fastboot/Factory firmware package using authorized servicing software (or run fastboot flash scripts for dynamic partitions) to restore the full system image and reboot into the setup wizard.
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